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Product Name:
Multilayer PCB
Product Details
Brief Description
8 Layers High-density PCB for Telecom with 1.0±0.1mm Board Thickness
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Detailed Product Description
Layers: 8
Surface finish: ENIG+OSP
Board thickness: 1.0±0.1mm
Dimensions: 7.698 x 4.661mm
Min drill diameter: 0.3mm
Aspect ratio: 3.3:1
Line/space: 3mil/3mil
Material: FR4 150
Function: telecom
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