OSP differs from other surface treatment processes in that it functions as a barrier layer between copper and air; in short, OSP is a chemically grown organic film on a clean bare copper surface. This film has anti-oxidation, thermal shock resistance, and humidity resistance to protect the copper surface from rusting (oxidation or sulfurization) in the normal environment. At the same time, it must be easily assisted in the subsequent welding high temperature. The flux is quickly removed for soldering. An
osp pcb is an
organic solderability preservative board.
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